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Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute

Invitation for Bids

General Information
   Nov 4, 2024
   French
   Other
   published: Nov 4, 2024

Original Text

Fourniture d’un équipement de découpe de wafers d’une taille allant jusqu’à 200mm pour l’Institut LETI du CEA





  A proximité de Grenoble 38000 Isere


  Reste 25 jours - Date de clôture estimée : 29/11/2024  


  Acheteur : CEA Grenoble




Type d'avis : Avis de marché
Type de marché : Européen
Date de publication : 04/11/2024...
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